- Root Cause Analysis,
> Analyze problems with phone assembly and find the root cause.
> Analyze problems with phone assembly Test machine.
> Analyze problems with circuit assembly to tester signal, part module and consult with department concern.
> Analyze problems with phone Water Resistance Test.
> Analyze problems with phone Cosmetic. (scratch, dent etc.)
- Monitor defect and improve yield.
- Report and discuss with related parties.
- Verify machine and review process.
- Have idea for creating program to record defect Real time.