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กุมภาพันธ์ 2554 ถึง เมษายน 2568

ตำแหน่ง Principle engineer-process

บริษัท Microchip Technology (Thailand) Co.,Ltd.

ที่อยู่บริษัท หมู่ที่ 1 14 ตำบล วังตะเคียน อำเภอเมืองฉะเชิงเทรา ฉะเชิงเทรา 24000

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
1) Process improvement and cost saving
• Qualify new plating chemical type to improve the process quality, UPH, and machine downtime by qualifying whisker monitoring with automotive package
• Qualify new supplier material “Tin Anode ball” for 2nd source material in the process
• Support chemical lab analysis and lab equipment for dairy analysis with plating process
• Upgrade & Improve the plating machine by install the sensor to detect strip drops to decrease defects in the process
• Change plating belt design from original design to Spring clip design to reduce plating damage frame and benefit to long life time for reduce cost
• Upgrade inline High pressure at plating machine to improve quality and reduce cycle time
• Design a new process flow (Skip High pressure process for QFN) to reduce the cycle time and quality improvement
• Upgrade Belt stripper process to efficiently remove tin on a belt for prevent excess plating problem
• Implement Chemical deburr process to reduce plate burr after saw for QFN wettable flank product
• Experiment to increase the plating speed to improve the plating process capacity
• Set project to reduce chemical fume with facility for set chemical scrubber system

2) Process set up and buy off
• Experience for set up & buy off equipment lab (AAS, UV visible, CVS and Ionic contamination) for support all plating chemical type analysis in the process
• Set up & buy off off-line chemical Deflash and High water pressure process to resolve glue and resin bleed issue
• Set up new plating machine (Meco)
• Review the process layout to support the new machine (Deflash, High pressure, and Plating)
• Implement SMD package solder reflow process on PCB board
• Implement Surface mount process simulation to inspect solder coverage at the critical lead area for SMD package
• Evaluate for QFN product new process saw half cut step of step cut flow to improvement the Solder fillet height at QFN lead expose copper area
• Study and evaluate the AOI machine applied to inspection quality defects with Semiconductor product
• Set up the system for resolve the quality failure and process monitoring system for better real-time action

3) Process quality control system
• Improvement plating machine UPH
• Improvement plating thickness CPK of X-bar, R chart to meet a target
• Quality improvement and maintain plating quality to meet DPPM target for Plating criteria and critical quality control is Plating thickness & Composition, Peel-off, Ionic contam and Solder ability test.
• Audit Tier-1 with Assembly Subcon
• Support customer and Internal audit for ISO audit TS16949, ISO14001 in the process by the target to zero major finding
• Experience for submitted 8D report to customer.
• Review and provide new WI, Process requirement, OCAP, and FMEA Spec to improve the process quality
• To do MSA analysis of X-ray thickness XRF and lab equipment in yearly period

4) New product qualification and subcon process qualification
• Local & Over sea Plating subcon qualification
- Pre CCB proposal and qualification plan
- Set team to Audit plating Subcon process
- Assemble the Qualification lot by cover Lead frame type (C194, C7025) by Plating quality and Whisker test qualify

• Qualify new product package in assembly process (QFN and Expose pad package) by use tooling such as
- Perform new design conversion kit load & off load plating machine for support new
product package
- Perform process DOE for Plating & Chemical Deflash process and complete report
- Perform process control plan and new process flow for the new package
- Perform process FMEA process
- Keep data records and review SPC process monitoring.

• Study and evaluate new roughening lead frame process to complete MSL1 for improvement Package Delamination

5) Process innovation
• To do the Patent about the Immersion Tin for Integrated circuit package with improved wettable flank for Solder connection with lead/leadless package

ตุลาคม 2551 ถึง มกราคม 2554

ตำแหน่ง Process engineer

บริษัท STATSChipPAC (Thailand) Ltd.

ที่อยู่บริษัท 101/32-33 นิคมอุตสาหกรรมนวนคร หมู่ที่ 20 ถนนพหลโยธิน กิโลเมตร 46 ตำบลคลองหนึ่ง อำเภอคลองหลวง จ.ปทุมธานี

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
1) Process improvement and cost saving
• Project leader [CFT] Cost functional team by DMAIC & DOE for chemical cost saving project by lead team do decrease chemical usage and evaluate new 2nd source of Chemical Deflash, Plating Preclean&Post clean chemical by target to 50% cost reduction
• Project implement Chemical Deflash UPH machine
• Quality improvement and maintain plating quality to meet DPPM target for Plating criteria and critical quality control is Plating thickness&Composition, Peel-off, Ionic contam and Solder ability test.
• Support new package by planning and coordinate with equipment to order new conversion kid load&un-load for new package to test run qual lot at plating process repair & implement new tooling in production line.
• Co-ordination to process concern for defect, finding at plating line to find real root cause & action.
• Monitor customer changing requirement in process responsibility.
• Assembly production line monitoring:
- Loading in-out
- Manage & analysis cycle time problem in assembly process.
- Manage engineering lot on hold in production line
- Control for production and machine maintenance with MQC, PM,

2) Process set up and buy off
• Set up Dry buffing process and machine buy off to improvement Mold flash on package.
• Set up magazine auto cleaning machine process

3) Process quality control system
• Experience for submitted 8D report to customer.
• Create chemical Deflash and plating program for test run qualification lot by control
plating quality to meet a customer spec.
• Improve Plating thickness CPK of X-bar, R chart, S chart and control % OOC to meet
a target
• Review SPC and update Plating, Chemical Deflash and Dry buffing FMEA by quarterly
• Review and update new procedure to improvement quality in WI, Spec and
provide Technical training for operators about technical data and operating procedure
• Create new Dry buffing, Chemical Deflash and Plating OCAP of all defect criteria
• Create new program Plating OCAP alert out of rule control limit for monitoring
• To do Plating/ Dry buffing/ Chemical Deflash PCE project (Process control engineer)
10 steps to buy off and optimize DOE parameter for run new package
• Support QOS(Quality operating system) for product control and Environmental/safety
concern
• To do prepare product sample to do Whisker monitoring test of all Matte tin machine
by period by refer JDEC standard
• To do MSA analysis of Chemical Deflash and Plating by period
• Support customer, ISO TS16949 and cooperate audit in process response by target to zero
major finding
• Prepare necessary information to CQE for customers per their requests.

กุมภาพันธ์ 2549 ถึง ตุลาคม 2551

ตำแหน่ง Process engineer

บริษัท Millenium Microtech (Thailand) company limited.

ที่อยู่บริษัท 17/2 หมู่ 18 ถนนสุวินทวงค์ ตำบลศาลาแดง อำเภอบางน้ำเปรี้ยว จังหวัดฉะเชิงเทรา 24000

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
1) Process improvement and cost saving
• Improvement plating yield and decrease rework rate for Solder dipping process
• Control plating quality to meet a customer requirement.
• To do project cost saving by find 2nd source for implement new preclean&post clean
chemical at plating process
• Implementation flow 100 into plating process
• Increase machine UPEH for gain productivity and decrease WIP in production line
• Support new package to load in plating line and Solder dipping by test run buy off and
optimized parameter
• Direct contact with customer for support customer requirement and send good quality
product to customer

2) Process set up and buy off
• Set semi-auto Solder (SAC305) dipping machine to support new package
• Implement new version plating chemical ST380 and test whisker test per JDEC standard

3) Process quality control system
• Support Internal audit, ISO TS16949, 14001 and customer Audit
• Generate document spec and set training operating procedure for control production line
• To responsible ISO 14001
• Monitoring plating thickness by use SPC program to control CPK and keep data to review
control limit

ประสบการณ์ทำงานอื่นๆ
Previous work place: KCE Electronic public company limited
• Manufacturing Engineer, KCE Electronic public company limited
• Period work, Jan 17’2005 – Jan 31’2006
• Job response : Pattern plating(PCB plating)process, Etching process.

• To responsible decrease yield defect and improve plating process yield
• To increase pattern plating machine UPH
• To improve patter plating process for support all product to maintain a good
quality yield and defect
• To do cost saving project in pattern plating process
• To support new product